Electro-physical technique for post-fabrication measurements of CMOS process layer thicknesses
نویسندگان
چکیده
منابع مشابه
Electro-Physical Technique for Post-Fabrication Measurements of CMOS Process Layer Thicknesses
This paper presents a combined physical and electrical post-fabrication method for determining the thicknesses of the various layers in a commercial 1.5 μm complementary-metal-oxide-semiconductor (CMOS) foundry process available through MOSIS. Forty-two thickness values are obtained from physical step-height measurements performed on thickness test structures and from electrical measurements of...
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ژورنال
عنوان ژورنال: Journal of Research of the National Institute of Standards and Technology
سال: 2007
ISSN: 1044-677X
DOI: 10.6028/jres.112.018